Microwave Oven First Time Use "10 Minutes with Water?

New microwave oven Just ask you to boil a cup of water. 4-5mins I try that for 4:30min and the water is bubbling boil. I guess they ask you to so that for seasoning the nachine so that it run smoothly and cleaner when you use it. maybe to smoothen out the oil or motor, belt, pulley but that just my opinions

1. how many different types of neurons are there in the human body and what are its function?

What level of detail is expected here? You can categorize neurons in a few different ways. The simplest way is to say that there are afferent neurons (sensory) and efferent neurons (motor). Sensory neurons take information TO the brain, and motor neurons take it away. You can also have intermediate neurons, which synapse (join) between sensory and motor neurons in places like reflex loops. You can also group neurons based on the neurotransmitters they secrete. The big ones are cholinergic, which are involved in stimulating muscle contraction, dopaminergic, which are involved in the basal ganglia (movement) and in the reward centre of the brain, and adrenergic which are involved in sympathetic responses. Another way is to categorize them by cell morphology (what the cell looks like). For example, the retina is made of ganglion cells, horizontal cells, amacrine cells, rods and cones. They all basically transmit the visual information to the rods and cones, where stuff happens before the message gets sent along the optic nerve to the brain. The difference in the cells is the number and shape of their processes, or in other words, their axons and dendrites. So in short, you can group neurons by where they go, what they secrete, and what they look like. Hopefully something here makes sense in the context of your class. :)

2. 1998 pontiac grand prix gt check engine light problem?


3. New to robotics. Controlling a servo?

You are new to servos so let me try to sort out some ideas for you. A servo is a system that can move a load at a predetermined rate...a rate servo. The sort of thing that drives a radar aerial at an airport...going round and round irrespective of the wind load on the aerial. Another type of servo is the positional servo which will move from one position to another at a predetermined rate...sort of thing that moves machinery from one position to another. The servo itself can be hydraulic, electric, or pneumatic. The hydraulic system will need a source of high pressure oil as the "power" supply. The electric servo needs electricity as its power supply and the pneumatic servo needs a supply of compressed air as its power supply. My knowledge is in electric servos and there are 3 distinct types depending on the motor technology. There is the stepping or stepper motor. This type of motor moves a precise angle for a pulse of energy applied to it. The angle of movement is fixed for each motor type and the list of angles is endless. Slight disavantage of the stepper motor is that it's torque output is fixed and if it is stalled then althought energy is being put in at the front end no movement will come out of the motor. The true servo motor can be either AC or DC. Why true servo motor because servos are the high performance motor...the GTI of the motor world. There have to deliver high performance all the time and must not fail so their carefull application is important. A Rate servo need to have a speed sensor attached to the motor so that the control system can see how fast the motor is rotating. The Positional servo needs to have the speed sensor and a rotary position sensor so that the control system can determine both speed and positional control. So getting back to your question, I would think that your wire should go to a stepper motor control drive and the stepper motor connected to the drive. By closing your signal the correct number of times you will get the motor to turn 90 degrees. Good luck

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IGBT of Fuji Motor Electronic Equipment Technology
The IGBT technology of Fuji motor and electronic equipment technology has been commercialized since 1988 and has been supplied in the market so far. Figure 1-3 shows the development process and application technology of IGBT products from the first generation to the fifth generation. Epitaxial wafers are used in the first to third generation IGBT, and the characteristics are improved by optimizing life cycle control and refinement technology of IGBT. Then, the fourth and fifth generation products have achieved significant characteristic improvement through the transition from epitaxial wafer to FZ (floating zone) wafer. In this regard, the design policy of IGBT has changed greatly compared with the past.Firstly, the basic design idea of IGBT using epitaxial wafer (series products up to 600V of the third to fourth generation, called "breakdown type") is as follows. In order to realize the low-pass state voltage during IGBT conduction, a large number of carriers are injected from the collector side to fill the IGBT with high concentration carriers. In addition, the n-buffer layer specially set to maintain the high voltage forms a very thin n-layer, so as to realize the low-pass state voltage. In order to realize fast exchange, life cycle control technology aiming at the rapid disappearance of carriers filled in IGBT is also adopted (through these, low exchange loss (eoff) can also be realized). However, once the life cycle control technology is applied, even in the normal on state, due to the effect of this technology (the carrier transport efficiency decreases), there is a problem of increasing the on state voltage, which can be solved by further high carrier injection.In short, the basic design concept of IGBT using epitaxial wafer technology can be simply summarized as "high injection and low transmission efficiency". In contrast, IGBTs using FZ wafers (series after the fourth generation 1200V) adopt a reverse basic design to inhibit the injection of carriers from the collector side and improve the transmission efficiency by reducing the injection efficiency. In the above-mentioned design concept of IGBT using epitaxial wafer "high injection and low transmission efficiency", the carriers that are not easy to be injected are forcibly suppressed through the control of life cycle, which not only limits the improvement of characteristics, but also increases the standard deviation of on-state voltage characteristics through the control of life cycle, It is very disadvantageous to the large capacity required for parallel use with increasing requirements in recent years. The technology developed to overcome this problem is a new IGBT using FZ chip (NPT: non punch through (used from the fourth generation IGBT) / FS: field stop (used from the fifth generation IGBT) - IGBT). The IGBT does not adopt life cycle control. Its basic design idea is to control the impurity concentration of the collector (P layer), so as to inhibit the carrier injection efficiency. However, in order to realize the characteristics superior to the IGBT using epitaxial wafer, it is also required to realize more than one hundred for the 1200V high voltage resistant series IGBT μ M (the thickness of n-layer in NPT and fs-igbt using FZ wafer ≈ the thickness of chip (wafer). The thinner the thickness, the lower the on state voltage can be generated). In short, it is not too much to call the development of IGBT using FZ chip a challenge to chip thickness.Fuji electric and electronic equipment technology has solved these problems. Starting from the fourth generation 1200V series - IGBT, it has realized the commercialization of "s series" constructed by FZ chip NPT. In addition, 600V series technology with higher thickness requirements is further developed, and 600v-u2 series (fifth generation) is being commercialized. In addition, in 1200V series - the fifth generation "U Series", in order to improve the performance better than s series, NPT structure has been changed to FS structure.The so-called FS structure does not use the life cycle control technology. While following the basic design concept of "low injection and high transport efficiency" of carriers, an n buffer layer to maintain voltage is set on the FZ wafer, so as to realize the IGBT structure thinner than the NPT structure. Through this change, 1200v-u series realizes the low on state voltage characteristic better than s series, and completes its commercialization. In addition, this technology is also used in 1700V series high voltage withstand series, and is also starting to be commercialized.Figure 1-3 changes of Fuji motor electronic equipment IGBT application technologyIn addition, Fuji electric and electronic equipment technology is also refining the surface structure indispensable for the improvement of IGBT characteristics (IGBT is formed by multiple IGBT plates. Through refinement, the more plates, the more low on-state voltage can be realized). Up to the fourth generation products, the planar structure (the structure of planar IGBT) has been used to promote refinement, so as to improve the characteristics. However, starting from the fifth generation products - 1200 and 1700V series, the grooved IGBT technology slotted on the Si surface and constituting IGBT has broken the subtle technical barrier and achieved unprecedented characteristic improvement. Figure 1-4 shows the change of characteristic improvement of 1200V series.Figure 1-4 improvement of balance characteristics
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